Shenzhen YGY Tempered Glass Co.,Ltd.

Shenzhen YGY Tempered Glass Co.,Ltd.

High quality, Best service,Reasonable price.

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3D Printer Multi-Layer Rigid PCB / 6 Layer Metal Core Printed Circuit Board Design

3D Printer Multi-Layer Rigid PCB / 6 Layer Metal Core Printed Circuit Board Design

  • 3D Printer Multi-Layer Rigid PCB / 6 Layer Metal Core Printed Circuit Board Design
  • 3D Printer Multi-Layer Rigid PCB / 6 Layer Metal Core Printed Circuit Board Design
3D Printer Multi-Layer Rigid PCB / 6 Layer Metal Core Printed Circuit Board Design
Product Details:
Place of Origin: China
Brand Name: XCE
Certification: CE,FCC,Rohs,ISO9001,SGS,UL
Model Number: XCER
Payment & Shipping Terms:
Minimum Order Quantity: 1PCS
Price: USD 1-500
Packaging Details: inner vacuum package, outer carton box
Payment Terms: Western Union, L/C, T/T
Supply Ability: 10000000pcs / per month
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Detailed Product Description
Layer: 6 Board Size: 17*6cm
Board THK: 1.2mm Cu THK: 35UM
Panel: 6*1 Color: Green
High Light:

printed pcb board

,

printed circuit board pcb

3D Printer Multi-Layer Rigid PCB Circuit Boards With Specialty Metal Core

 

 

Quick detail:

 

Place of Origin:Guangdong, China (Mainland)
Brand Name: XCE
Model Number: XCER
Number of Layers: 6-Layer
Base Material: FR-4
Copper Thickness: inner layers 1oz, outer layers 1.5oz
Board Thickness: 62mil
Surface Finishing:  immersion gold

 

 

 

Parameter:

 

 
Layer No. 1-26
Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness tolerance   T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness   >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)

 

 

PCB Capabilities By Market:

 

1.

High Reliability PC Boards

 

-Up to 2000 Thermal cycles

 

 

 

2.

Burn-in Boards

 

-6 Layers - .042" thick

 

-.5 mm pitch

 

-Step-down connectors

 

-Special materials

 

-Large sizes up to 24" x 28"

 

-High Reliability

 

3.

High Technology Boards

 

-Microelectronics (Line and Space down to .00125"/.00125") 

 

-Differential Impedance

 

-Up to 30 Layers

 

-Lead Free process

 

-Special materials

 

-Sequential lamination

 

-Blind and buried vias

 

-Laser Drill

 

-Filled vias

 

-Via in pads

 

-Milspec

 

 

Contact Details
Shenzhen YGY Tempered Glass Co.,Ltd.

Contact Person: Miss. YOYO

Tel: 1871153246

Send your inquiry directly to us (0 / 3000)

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